Français
Español
Italiano
Deutsch
Odroid N2+ Card
€119.00
(Price Tax included)
ODROID-N2Plus is a next-generation single-board computer that is more powerful, more stable and faster than N1.
The main processor of the N2+ is based on the big.Little architecture, which integrates a quad-core ARM Cortex-A73 processor cluster and a dual-core Cortex-A53 cluster with a next-generation Mali-G52 graphics processor.
Thanks to modern 12nm silicon technology, the A73 cores operate at 1.8GHz without thermal limitation through the metal-cased heatsink, resulting in a robust and quiet computer.
The performance of the multi-core processor is about 20% faster and the graphics processor 10% faster than the N1. The N2+'s DDR4 RAM operates at 1320 MHz with a power consumption of 1.2 volts.
The large metal case heat sink is designed to optimize heat dissipation from the processor and RAM and minimize throttling. The processor is placed on the bottom side of the PCB to establish good thermal characteristics.
ODRN2-4GB
19 Items
You might also like
Comments (0)
No customer reviews for the moment.
Customers who bought this product also bought:
Questions (0)
No customer questions for the moment.
Your Question has been successfully sent our team. Thanks for question!
Ask a question
hide form
ODROID-N2Plus is a next-generation single-board computer that is more powerful, more stable and faster than N1.
The main processor of the N2+ is based on the big.Little architecture, which integrates a quad-core ARM Cortex-A73 processor cluster and a dual-core Cortex-A53 cluster with a next-generation Mali-G52 graphics processor.
Thanks to modern 12nm silicon technology, the A73 cores operate at 1.8GHz without thermal limitation through the metal-cased heatsink, resulting in a robust and quiet computer.
The performance of the multi-core processor is about 20% faster and the graphics processor 10% faster than the N1. The N2+'s DDR4 RAM operates at 1320 MHz with a power consumption of 1.2 volts.
The large metal case heat sink is designed to optimize heat dissipation from the processor and RAM and minimize throttling. The processor is placed on the bottom side of the PCB to establish good thermal characteristics.